Features
- Highly accurate dual-nozzle Pick &Place UPH2400
- Flexible multi media I/O include tray, tape and tube package
- Embedded SG8000 universal programmer with up to 64 programming sites,
- supports EEPROM, NOR, Nand, MCU, CPLD, FPGA, eMMC, UFS
- Easy-to-use teach mechanism with minimum overheads for change-over
- Optical 2D inspection module
- One-Piece-fl ow operation
General information
- Throughput: 2400UPH with zero index time
- Placement accuracy: ±0.02mm
- Placement repeatability: ±0.02mm
- Placement force: 95 grams
- Pick-and-place method: Double nozzles
- Dimension : L:1450 x L:1190 x H : 1965(mm)
- Shipping Dim.: L:1940 x L:1390 x H:1840 (mm)
Placement system
- X-Y axes driving system: Servo motor
- X axis resolution: 0.001mm
- Y axis resolution: 0.001mm
- X-Y repeatability: ±0.01mm
- Z-theta driving system: Stepping motor
- Z-axis resolution: 0.036°
- Z-axis repeatability: ±0.02mm
Operating requirements
- Input voltage: Single-phase 220 VAC
- Input line frequency: 50/60Hz 15A
- Power consumption: 2.0KVA
- Compressed air pressure: 0.6Mpa
- Air fl ow: 40 liters/min
- Operation temperature range: 15~30°C (59~86°F)
- Relative humidity: 35%~90%
Programming system
- Up to 4 units of SG SG8000 universal programmer
- Programming sockets: up to 32 sockets sites for eMMC and 32 socket sites for memory/MCU
- Devices support: EPROM, EEPROM, NOR, NAND, MCU, PLD, CPLD, FPGA, eMMC et UFS
- Package types: TSOP, PLCC. BGA, SOIC, SOP, QFN, CSP, TQFP and more
Position recognition system
- Gantry: Double nozzle gantry
- Upward camera x2: (Standard) Component position recognition system (1.3M pixels, FOV 35x35mm)
- Downward CCD x1 for teach alignment (1.3M pixels, FOV 35x35mm)
- Alignment Mechanism: Mechanical teach positioning (Precisor)
Optional subsystems (not included)
- Auto tray stacker (25)
- Tape and reel input/output unit (8~72mm)
- Tube input unit (up to 6 Max)
- Ink dot Marker
- Inkjet Marker
- Label Feeder
- Optical 2D inspection module