Jade MKII
Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility, our latest entry-level system offers uncompromised selective soldering quality at a very low cost.
The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB's or pallets up to 457 x 508mm.
Our new generation patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep
maintenance levels to a minimum whilst enabling use of higher solids content fluxes as well as water soluble fluxes.
As part of the entry level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.
As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local pre-heat to the joint thus reducing thermal shock to localised components.
The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based “Point & Click” interface with PCB image display, as illustrated below.
Additionally, our optional PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
The Jade MKII is a hand load system, incorporating a universally adjustable tooling carrier capable of accommodating PCB's or pallets up to 457 x 508mm.
Our new generation patented drop-jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep
maintenance levels to a minimum whilst enabling use of higher solids content fluxes as well as water soluble fluxes.
As part of the entry level philosophy for this system, a newly designed low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP-1 nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.
As with more sophisticated Pillarhouse systems, the soldering process is enhanced by an inerted hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local pre-heat to the joint thus reducing thermal shock to localised components.
The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based “Point & Click” interface with PCB image display, as illustrated below.
Additionally, our optional PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.
Video Jade MKII
TECHNICAL SPECIFICATIONS
- Height (excluding light tower):1403mm (55”)
- Width: 1000mm (40“)
- Depth: 1351mm (53”)
- Board Size: 457mm x 508mm (18” x 20”) (larger PCB size available upon request)
- Edge Clearance: Above / below 3mm
- Height Clearance: Above / below 40mm nominal, 70mm max. Above 190mm - special application
- Solder: All commonly used solder types (including Lead Free).
- Solder Pot Capacity: 8kg (18lb)
- Applicators: AP-1 style (2.5, 3, 4, 6, 8, 10, 12mm)
- Extended and Jet-Tip nozzles (up to 25mm dia)
- Jet-Wave nozzles (up to 25mm width)
- Special dedicated nozzles available upon request
- Flux: Low maintenance drop-jet system. Low solids, no clean flux, pressurised and inerted system, optional water soluble system available
- X, Y & Z Axis Resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen Usage: 35 litres gas/min. 5 bar pressure
- Nitrogen Purity: 99.995% or better
- Power Supplies: Single phase + PE
- Voltage: 230 Volts
- Frequency: 50/60Hz
- Power (no I.R preheat): 4.0kVA (with I.R preheat): 6.5kVA (Top side)
- 8kVA (Top with Bottom side ring heater)
- Transport: Hand load
- Tooling: Integral adjustable board guides, includes finger extensions and board clamps
- Programming: Windows® based PillarCOMM ‘Point & Click’ programming
STANDARD FEATURES
- Integral PC and machine mounted TFT monitor
- Inerted nitrogen system
- Auto solder top-up (wire feed) & solder level detect
- Drop -jet fluxer
- Two AP-1 solder nozzle tips
- Internal fume extraction
- Colour programming camera
- Universally adjustable tooling carrier
- PillarCOMM windows software
- Lead free compatible
OPTIONS
- Ultrasonic fluxing
- Dual drop-jet / ultrasonic fluxing
- Flux presence sensor
- Flux spray or flow monitoring
- Flux spray & flow monitoring
- Pump rpm monitoring
- O² ppm monitoring
- Topside instant I.R. pre-heat
- Bottom side slide in / slide out I.R. pre-heat
- Pyromter closed loop temperature control (available top and / or bottom side)
- Solder wave height measurement and correction system
- Bottom side hot nitrogen selective pre-heat
- Fiducial recognition and correction system
- Laser board warpage control
- Multiple level password protection
- PillarPAD offline programming system
- Nitrogen flow monitoring
- Solder reel identification
- Solder bath coding (identifies correct bath for program)
- Encoders on X, Y and Z axis
- Nitrogen generator