Technical spécification
Height: | With monitor 1025mm / 40” With cowling 726mm / 29” - without 670mm / 26” |
Width : | With flux bottles 1090mm / 43” - without 915mm / 36” with solder bath out 1380mm / 54” |
Depth : | 700mm / 28” to 963mm / 38” with keypad tray out |
Board size : | 330mm x 250mm / 13" x 10" |
Edge clearance : | Above / below 3mm |
Height clearance : | Above / below 40mm nominal, 55mm Max |
Solder : | All commonly used solder types - including lead-free |
Solder pot capacity : | 6kg / 13lb |
Applicators : | - AP style - 2.5mm to 16mm Ø. - Extended AP style - 2.55mm to 20mm Ø - NB - Micro nozzle - 1.5mm to 2.5mm Ø - Jet-Tip style - 6mm to 40mm Ø. - Special dedicated nozzles available upon request |
Flux : | Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available |
X, Y & Z Axis resolution : | 0,1mm |
Repeatability : | +/- 0,05mm |
Nitrogen usage : | 30 liters gas/min. |
Pression : | 5 bar |
Nitrogen purity : | 99,99% Ou supérieur |
Power supplies : | Single phase + PE - 208V / 250V - 50/60Hz |
Power : | 4kVA including bottom-side IR preheat |
Transport : | Hand load |
Tooling : | Integral adjustable board guides, includesfinger extensions and board clamps |
Programming : | Fonctionne sous Windows : - PillarCOMM ‘Point & Click’ - |
Standard features
• Integral PC and machine mounted TFT monitor
• Inerted nitrogen system
• Drop-Jet fluxer
• Two AP style solder nozzle tips
• Internal fume extraction
• Colour programming camera
• Two universally adjustable tooling carrier
• PillarCOMM LITE
• Windows® based ‘Point & Click’ interface
• Lead-free compatible
• Day-to-day service kit
System options
• Fume filtration system
• Manual fiducial correction
• Micro nozzle assembly
• PillarPAD offline programming system
• Multiple level password protection
• Bottom-side preheater
• PillarGEN 30 nitrogen generator and machine stand